Heat sink for integrated-circuit chip carrier

Abstract

Description

FIG. 1 is a perspective view of a heat sink for integrated-circuit chip carrier showing my new design, the broken lines being shown for illustrative purposes only;

FIG. 2 is a perspective view thereof, omitting the broken lines for clarity of disclosure;

FIG. 3 is a side elevational view thereof, looking upwardly toward the right in relation to the heat sink as it is shown in FIG. 1;

FIG. 4 is a side elevational view thereof, looking upwardly toward the left in relation to the heat sink as it is shown in FIG. 1;

FIG. 5 is a top plan view thereof; and

FIG. 6 is a bottom plan view thereof.

Claims

The ornamental design for a heat sink for integrated-circuit chip carrier, substantially as shown and described.