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The ornamental design for a printed circuit board stand-off, as shown and described. |
FIG. 1 is an isometric view of a printed circuit board stand-off showing my new design;
FIG. 2 is a front elevational view thereof, the rear view being a mirror image;
FIG. 3 is a top plan view thereof, the bottom plan view being a mirror image;
FIG. 4 is a side elevational view thereof, the side opposite being a mirror image;
FIG. 5 is a sectional view taken along line 5--5 of FIG. 4;
FIG. 6 is a sectional view taken along line 6--6 of FIG. 2; and
FIG. 7 is a sectional view taken along line 7--7 of FIG. 1.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 20 1985 | HILL, ROYCE W | MICRO PLASTICS INC | ASSIGNMENT OF ASSIGNORS INTEREST | 004374 | /0242 | |
Feb 22 1985 | Micro Plastics, Inc. | (assignment on the face of the patent) | / |
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