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The ornamental design for a printed circuit board stand-off, as shown and described. |
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FIG. 1 is an isometric view of a printed circuit board stand-off showing my new design;
FIG. 2 is a front elevational view thereof, the rear elevational view being a mirror image;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a side elevational view thereof, the side opposite being a mirror image;
FIG. 6 is a cross sectional view thereof taken along the line 6--6 of FIG. 5;
FIG. 7 is a cross sectional view taken along the line 7--7 of FIG. 2;
FIG. 8 is a cross sectional view taken along line 8--8 of FIG. 1; and
FIG. 9 is a cross sectional view taken along line 9--9 of FIG. 1.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 22 1985 | HILL, ROYCE W | MICRO PLASTICS NC | ASSIGNMENT OF ASSIGNORS INTEREST | 004378 | /0419 | |
| Feb 27 1985 | Micro Plastics, Inc. | (assignment on the face of the patent) | / |
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