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The ornamental design for a circuit board support, as shown and described. |
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FIG. 1 is a perspective view of a circuit board support showing my new design;
FIG. 2 is a side elevational view thereof, the side opposite being a mirror image;
FIG. 3 is a front elevational view thereof;
FIGS. 4 and 5 are respectively top and bottom plan views thereof;
FIGS. 6 and 7 are sectional views taken respectively along line 6--6 of FIG. 3 and line 7--7 of FIG. 1;
FIG. 8 is a sectional view taken along line 8--8 of FIG. 1; and
FIG. 9 is a rear elevational view thereof.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Apr 11 1985 | HILL, ROYCE W | MICRO PLASTICS, INC | ASSIGNMENT OF ASSIGNORS INTEREST | 004398 | /0046 | |
| Apr 16 1985 | Micro Plastics, Inc. | (assignment on the face of the patent) | / |
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