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The ornamental design for a heat sink or similar article, as shown and described. |
FIG. 1 is a top plan view of a heat sink or similar article showing our new design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a top, front perspective view thereof on an enlarged scale;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a top plan view of a second embodiment of a heat sink or similar article showing our new design;
FIG. 9 is a right side elevational view thereof;
FIG. 10 is a bottom plan view thereof;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a top, front perspective view thereof on an enlarged scale
FIG. 13 is a left side elevational view thereof;
FIG. 14 is a rear elevational view therefor.
Horvath, Joseph L., Hultmark, Eric B.
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Patent | Priority | Assignee | Title |
3638073, | |||
4620216, | Apr 29 1983 | International Business Machines Corporation | Unitary slotted heat sink for semiconductor packages |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 10 1987 | HULTMARK, ERIC B | BUSINESS MACHINES CORPORATION, ARMONK, NEW YORK 10504 A CORP OF NEW YORK | ASSIGNMENT OF ASSIGNORS INTEREST | 004803 | /0180 | |
Sep 11 1987 | HORVATH, JOSEPH L | BUSINESS MACHINES CORPORATION, ARMONK, NEW YORK 10504 A CORP OF NEW YORK | ASSIGNMENT OF ASSIGNORS INTEREST | 004803 | /0180 | |
Sep 16 1987 | International Business Machines Corporation | (assignment on the face of the patent) | / |
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