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The ornamental design for an electronic package carrier, as shown and described. |
FIG. 1 is a perspective view of an electronic package carrier showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a side elevational view thereof, the opposite side being a mirror image of that shown;
FIG. 5 is a front elevational view thereof; and
FIG. 6 is a rear elevational view thereof.
Patent | Priority | Assignee | Title |
D489982, | Feb 20 2003 | Asahi Kasei Kabushiki Kaisha | Cushioning material for packaging |
Patent | Priority | Assignee | Title |
3409861, | |||
3652974, | |||
3746157, | |||
3963315, | Apr 07 1975 | Lockhead Missiles & Space Company, Inc. | Semiconductor chip carrier and testing fixture |
4026412, | Sep 26 1974 | Electronic circuit carrier and test fixture | |
4718548, | Dec 19 1986 | Advanced Micro Devices, Inc. | Protective housing for a leadless chip carrier or plastic leaded chip carrier package |
D257425, | Dec 08 1977 | Integrated circuit carrier |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 16 1988 | Milross Controls, Inc. | (assignment on the face of the patent) | / | |||
Nov 08 1993 | MILROSS CONTROLS INC | INTERNAL REVENUE SERVICE | SEIZURE | 006817 | /0625 |
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