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The ornamental design for a temperature sensor for pipes, as shown and described. |
FIG. 1 is a top plan view of a temperature sensing instrument for pipes showing my new design;
FIG. 2 is a bottom plan view;
FIG. 3 is a left side elevational view, the right side elevational view being a mirror image;
FIG. 4 is a rear elevational view;
FIG. 5 is a front elevational view; and
FIG. 6 is a top, front and left side perspective view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 11 1989 | HING-WAH, HUEN | FAIRFORM MFG CO , LTD , 5 F, SHING KING INDUSTRIAL BUILDING | ASSIGNMENT OF ASSIGNORS INTEREST | 005097 | /0422 | |
Jun 30 1989 | Fairform Mfg. Co., Ltd. | (assignment on the face of the patent) | / |
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