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The ornamental design for housings for electronic circuits, as shown and described. |
FIG. 1 is a front, top and right side perspective view of a housing for electronic circuits showing my new design;
FIG. 2 is a top-plan view thereof;
FIG. 3 is a bottom-plan view thereof;
FIG. 4 is a front-elevational view thereof;
FIG. 5 is an inverted rear elevational view thereof; and,
FIG. 6 is a left side elevational view thereof, the right side elevational view thereof being a mirror image.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 17 1989 | FAST Electronic GmbH | (assignment on the face of the patent) | / | |||
Mar 12 1990 | CONSTIEN, PETER | FAST ELECTRONIC GMBH, A GERMAN CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005745 | /0108 |
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