|
The ornamental design for a intergrated circuit tester, as shown and described. |
|||||||||||||||||
FIG. 1 is a top, front and right side perspective view of a intergrated circuit tester showing our new design;
FIG. 2 is a top, front and right side perspective view, with the circuitry enclosure rotated 180 degrees;
FIG. 3 is a top plan view;
FIG. 4 is a right side elevational view;
FIG. 5 is a front elevational view;
FIG. 6 is a rear elevational view;
FIG. 7 is a top, front and right side perspective view of a second embodiment of our new design of FIGS. 1-6;
FIG. 8 is a top, front and right side perspective view, with the circuitry enclosure rotated 180 degrees;
FIG. 9 is a top plan view;
FIG. 10 is a right side elevational view, the left side elevational view being a mirror image;
FIG. 11 is a front elevational view;
FIG. 12 is a rear elevational view;
FIG. 13 is a top, front and right side perspective view of a third embodiment of our new design of FIGS. 1-6;
FIG. 14 is a top, front and right side perspective view, with the circuitry enclosure rotated 180 degrees;
FIG. 15 is a top plan view;
FIG. 16 is a right side elevational view, the left side elevational view being a mirror image;
FIG. 17 is a front elevational view; and
FIG. 18 is a rear elevational view thereof.
Schwar, Charles H., Tegethoff, Mauro V., Dahlberg, Bjorn M.
| Patent | Priority | Assignee | Title |
| D977358, | Sep 04 2020 | ELECTRONIC CONTROLS COMPANY | Sounder housing |
| Patent | Priority | Assignee | Title |
| 4504783, | Sep 30 1982 | STORAGE TECHNOLOGY PARTNERS THROUGH STC COMPUTER RESEARCH CORPORATION, MANAGING PARTNER , A LIMITED PARTNERSHIP OF CO | Test fixture for providing electrical access to each I/O pin of a VLSI chip having a large number of I/O pins |
| 4528504, | May 27 1982 | Intersil Corporation | Pulsed linear integrated circuit tester |
| 4782289, | May 30 1986 | Hilevel Technology, Inc.; HILEVEL TECHNOLOGY, INC , A CORP OF CA | Positioning fixture for integrated circuit chip testing board |
| 4782291, | Oct 04 1985 | Method and apparatus for the testing of active or passive electrical devices in a sub-zero environment | |
| 4970461, | Jun 26 1989 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Method and apparatus for non-contact opens/shorts testing of electrical circuits |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 10 1989 | DAHLBERG, BJORN M | HILEVEL TECHNOLOGY, INC , A CA CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005038 | /0056 | |
| Jan 10 1989 | SCHWAR, CHARLES H | HILEVEL TECHNOLOGY, INC , A CA CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005038 | /0056 | |
| Jan 10 1989 | TEGETHOFF, MAURO V | HILEVEL TECHNOLOGY, INC , A CA CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005038 | /0056 | |
| Jan 11 1989 | Hilevel Technology | (assignment on the face of the patent) | / |
| Date | Maintenance Fee Events |
| Date | Maintenance Schedule |