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The ornamental design for a intergrated circuit tester, as shown and described. |
FIG. 1 is a top, front and right side perspective view of a intergrated circuit tester showing our new design;
FIG. 2 is a top, front and right side perspective view, with the circuitry enclosure rotated 180 degrees;
FIG. 3 is a top plan view;
FIG. 4 is a right side elevational view;
FIG. 5 is a front elevational view;
FIG. 6 is a rear elevational view;
FIG. 7 is a top, front and right side perspective view of a second embodiment of our new design of FIGS. 1-6;
FIG. 8 is a top, front and right side perspective view, with the circuitry enclosure rotated 180 degrees;
FIG. 9 is a top plan view;
FIG. 10 is a right side elevational view, the left side elevational view being a mirror image;
FIG. 11 is a front elevational view;
FIG. 12 is a rear elevational view;
FIG. 13 is a top, front and right side perspective view of a third embodiment of our new design of FIGS. 1-6;
FIG. 14 is a top, front and right side perspective view, with the circuitry enclosure rotated 180 degrees;
FIG. 15 is a top plan view;
FIG. 16 is a right side elevational view, the left side elevational view being a mirror image;
FIG. 17 is a front elevational view; and
FIG. 18 is a rear elevational view thereof.
Schwar, Charles H., Tegethoff, Mauro V., Dahlberg, Bjorn M.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 10 1989 | DAHLBERG, BJORN M | HILEVEL TECHNOLOGY, INC , A CA CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005038 | /0056 | |
Jan 10 1989 | SCHWAR, CHARLES H | HILEVEL TECHNOLOGY, INC , A CA CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005038 | /0056 | |
Jan 10 1989 | TEGETHOFF, MAURO V | HILEVEL TECHNOLOGY, INC , A CA CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005038 | /0056 | |
Jan 11 1989 | Hilevel Technology | (assignment on the face of the patent) | / |
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