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The ornamental design for a package for electronic parts or the like, as shown and described. |
FIG. 1 is a front perspective view of a package for electronic parts or the like showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevation thereof;
FIG. 4 is a rear elevation thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevation thereof; and
FIG. 8 is a right side elevation thereof.
Takahashi, Tetsuo, Takahashi, Kuniaki, Kudo, Koji
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 16 1989 | TAKAHASHI, TETSUO | TDK CORPORATION, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005160 | /0591 | |
Oct 16 1989 | TAKAHASHI, KUNIAKI | TDK CORPORATION, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005160 | /0591 | |
Oct 16 1989 | KUDO, KOJI | TDK CORPORATION, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005160 | /0591 | |
Oct 18 1989 | TDK Corporation | (assignment on the face of the patent) | / |
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