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The ornamental design for an instrument for transferring boats for thermal treatment of semiconductor wafers, as shown and described. |
FIG. 1 is a top, front and right side perspective view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a left side elevational view;
FIG. 3 is a front elevational view, the rear elevational view being a mirror image;
FIG. 4 is a top plan view;
FIG. 5 is a bottom plan view; and
FIG. 6 is a right side elevational view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 25 1989 | Tel Sagami Limited | (assignment on the face of the patent) | / | |||
Feb 23 1989 | ISHII, KATSUMI | Tel Sagami Limited | ASSIGNMENT OF ASSIGNORS INTEREST | 005895 | /0413 | |
Feb 23 1989 | KATOH, MITSUO | Tel Sagami Limited | ASSIGNMENT OF ASSIGNORS INTEREST | 005895 | /0413 |
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