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The ornamental design for a handling arm for boats for thermal treatment of semiconductor wafers, as shown and described. |
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FIG. 1 is a top, front and right side perspective view of a handling arm for boats for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a front elevational view;
FIG. 3 is a left side elevational view;
FIG. 4 is a top plan view;
FIG. 5 is a bottom plan view; and
FIG. 6 is a rear elevational view thereof.
Ishii, Katsumi, Watanabe, Shingo, Katoh, Mitsuo
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 25 1989 | Tel Sagami Limited | (assignment on the face of the patent) | / | |||
| Feb 23 1989 | ISHII, KATSUMI | TEL SAGAMI LIMITED A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005900 | /0027 | |
| Feb 23 1989 | KATOH, MITSUO | TEL SAGAMI LIMITED A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005900 | /0027 | |
| Feb 23 1989 | WATANABE, SHINGO | TEL SAGAMI LIMITED A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005900 | /0027 |
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