Patent
   D324057
Priority
Jul 25 1988
Filed
Jan 25 1989
Issued
Feb 18 1992
Expiry
Feb 18 2006
Assg.orig
Entity
unknown
0
6
n/a
The ornamental design for an instrument for holding boats for thermal treatment of semiconductor wafers, as shown.

FIG. 1 is a front elevational view of an instrument for holding boats for thermal treatment of semiconductor wafers showing our new design;

FIG. 2 is a left side elevational view;

FIG. 3 is a right elevational view;

FIG. 4 is a top plan view;

FIG. 5 is a bottom plan view; and

FIG. 6 is a rear elevational view thereof.

Ishii, Katsumi, Wada, Atsushi

Patent Priority Assignee Title
Patent Priority Assignee Title
4344729, Feb 08 1980 BBH, INC Break-away device
4787805, Feb 28 1986 Atotech Deutschland GmH Device for the insertion into and removal from a suspended frame of parts being galvanized
199694,
D272743, Jun 08 1981 Clamp for plating barrel
JP28151,
SU727731,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 25 1989Tel Sagami Limited(assignment on the face of the patent)
Feb 23 1989ISHII, KATSUMITEL SAGAMI LIMITED, A CORP OF JAPANASSIGNMENT OF ASSIGNORS INTEREST 0059350423 pdf
Feb 23 1989WADA, ATSUSHITEL SAGAMI LIMITED, A CORP OF JAPANASSIGNMENT OF ASSIGNORS INTEREST 0059350423 pdf
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