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The ornamental design for an instrument for holding boats for thermal treatment of semiconductor wafers, as shown. |
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FIG. 1 is a front elevational view of an instrument for holding boats for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a left side elevational view;
FIG. 3 is a right elevational view;
FIG. 4 is a top plan view;
FIG. 5 is a bottom plan view; and
FIG. 6 is a rear elevational view thereof.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 25 1989 | Tel Sagami Limited | (assignment on the face of the patent) | / | |||
| Feb 23 1989 | ISHII, KATSUMI | TEL SAGAMI LIMITED, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005935 | /0423 | |
| Feb 23 1989 | WADA, ATSUSHI | TEL SAGAMI LIMITED, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005935 | /0423 |
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