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The ornamental design for a lead wire cutting machine, as shown and described. |
FIG. 1 is a top, front and left side perspective view of a lead wire cutting machine showing my new design;
FIG. 2 is a front elevational view;
FIG. 3 is a rear elevational view;
FIG. 4 is a left side elevational view;
FIG. 5 is a right side elevational view;
FIG. 6 is a top plan view;
FIG. 7 is a bottom plan view; and,
FIG. 8 is a top plan view thereof, shown in working condition.
FIGS. 2-8 have been drawn to a reduced scale with respect to FIG. 1.
Patent | Priority | Assignee | Title |
D343626, | Feb 12 1992 | Automatic wire stripping and cutting machine | |
D854059, | Sep 08 2017 | WAZER INC.; WAZER INC | Cutting device |
Patent | Priority | Assignee | Title |
3396758, | |||
3799017, | |||
4624160, | Oct 31 1983 | AMERICAN TECH MANUFACTURING CORPORATION, 21 KENTON LANDS ROAD, ERLANGER, KENTUCKY 41018, A CORP OF DE | Method and apparatus for trimming the leads of electronic components |
4696178, | Feb 16 1982 | Otto, Bihler | Wire and band processing machine |
D292100, | Sep 12 1983 | Carpenter Manufacturing Co. | Automatic wire cutting machine |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 14 1989 | SAITO, MASAYUKI | NITTO SEIKO CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 005241 | /0402 | |
Sep 27 1989 | Nitto Seiko Co., Ltd. | (assignment on the face of the patent) | / |
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