Instrument for transferring boats for thermal treatment of semiconductor wafers

Abstract

Description

FIG. 1 is a front elevational view of an instrument for transferring boats for thermal treatment of semiconductor wafers showing our new design;

FIG. 2 is an elevational view, the remainder of the cylindrical member being the same throughout in appearance;

FIG. 3 is a top plan view;

FIG. 4 is a bottom plan view;

FIG. 5 is an elevational view thereof;

FIG. 6 is a top perspective view; and,

FIG. 7 is a bottom perspective view thereof.

Claims

The ornamental design for an instrument for transferring boats for thermal treatment of semiconductor wafers, as shown.