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The ornamental design for a high density edgecard connector, as shown and described. |
FIG. 1 is a rear and upper right perspective view of a high density edgecard connector showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 10 1990 | MARACH, DAVID R | COOPER INDUSTRIES, INC , A CORP OF OH | ASSIGNMENT OF ASSIGNORS INTEREST | 005333 | /0660 | |
Apr 19 1990 | Cooper Industries | (assignment on the face of the patent) | / | |||
Jan 01 1998 | Cooper Industries, Inc | Cooper Technologies Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008920 | /0872 |
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