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The ornamental design for a modular test adapter for telecommunications circuits, as shown and described. |
FIG. 1 is a front perspective view of a modular test adapter for telecommunications circuits showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a right side elevational view thereof with the left side elevational view being identical to FIG. 6.
Siemon, John A., Below, Randall J.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 04 1990 | SIEMON, JOHN A | SIEMON COMPANY, THE | ASSIGNMENT OF ASSIGNORS INTEREST | 005534 | /0166 | |
Dec 05 1990 | BELOW, RANDALL J | SIEMON COMPANY, THE | ASSIGNMENT OF ASSIGNORS INTEREST | 005534 | /0166 | |
Dec 07 1990 | The Siemon Company | (assignment on the face of the patent) | / |
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