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The ornamental design for an electronic equipment power amplifier module, as shown and described. |
FIG. 1 is a perspective view of the front, top, and right side of an electronic equipment power amplifier module showing a first embodiment of our new design;
FIG. 2 is a left elevational of the first embodiment;
FIG. 3 is a rear elevational view of the first embodiment;
FIG. 4 is a bottom plan view of the first embodiment;
FIG. 5 is a top, right and front perspective view of an electronic equipment power amplifier module showing a second embodiment of our new design;
FIG. 6 is a top plan view of the first embodiment;
FIG. 7 is a right side elevational view of the first embodiment;
FIG. 8 is a left side elevational view of the second embodiment;
FIG. 9 is a rear elevational view of the second embodiment; and,
FIG. 10 is a bottom plan view of the second embodiment.
Lubbe, John, Onyszko, Lester J.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 04 1991 | Motorola, Inc. | (assignment on the face of the patent) | / | |||
Oct 04 1991 | LUBBE, JOHN | MOTOROLA, INC A CORPORATION OF DELAWARE | ASSIGNMENT OF ASSIGNORS INTEREST | 005867 | /0041 | |
Oct 04 1991 | ONYSZKO, LESTER J | MOTOROLA, INC A CORPORATION OF DELAWARE | ASSIGNMENT OF ASSIGNORS INTEREST | 005867 | /0041 |
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