Individual wafer package

Abstract

Description

FIG. 1 is a perspective view of an individual wafer package showing our new design;

FIG. 2 is a left side elevational view thereof; the right side elevational view being a mirror image thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Claims

The ornamental design for an individual wafer package, as shown and described.