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The ornamental design for a wafer basket, as shown and described. |
FIG. 1 is a front elevational view of a wafer basket showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof, the right side elevational view being a mirror image thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a sectional elevational view thereof; taken along line 6--6 of FIG. 3.
Naito, Naoki, Ishikawa, Toshio, Takamatsu, Naoyuki, Koshikawa, Kazunori
Patent | Priority | Assignee | Title |
5657879, | Feb 05 1996 | SEH America, Inc. | Combination wafer carrier and storage device |
Patent | Priority | Assignee | Title |
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4493418, | Aug 17 1983 | EMPAK, INC | Wafer processing cassette |
4743156, | May 09 1986 | Motorola, Inc.; MOTOROLA, INC , A CORP OF DE ; MOTOROLA INC , A CORP OF DE | Dump transfer wafer carrier |
4926092, | Sep 29 1988 | North American Philips Corporation | Stem with molded back-fill gas directional diffuser |
5011041, | Sep 14 1988 | MIRAIAL CO , LTD | Basket for processing thin plates |
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 28 1991 | Shin-Etsu Handotai Co., Ltd. | (assignment on the face of the patent) | / | |||
May 26 1993 | NAITO, NAOKI | SHIN-ETSU HANDOTAI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006949 | /0609 | |
May 26 1993 | TAKAMATSU, NAOYUKI | SHIN-ETSU HANDOTAI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006949 | /0609 | |
Jun 07 1993 | ISHIKAWA, TOSHIO | SHIN-ETSU HANDOTAI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006949 | /0609 | |
Jun 07 1993 | KOSHIKAWA, KAZUNORI | SHIN-ETSU HANDOTAI CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006949 | /0609 |
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