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The ornamental design for a heat sink clip for surface-mount integrated circuit, as shown and described. |
FIG. 1 is a front, top, and right side perspective view showing our new design for a heat sink clip for surface-mount integrated circuit;
FIG. 2 is a left elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a front, top, and right side perspective view showing an alternate embodiment for a heat sink clip for surface mount integrated circuit, the front, top, and left side perspective view being a mirror image.
Widmayer, Robert B., Steen, Jr., Carl A.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 28 1991 | STEEN, CARL A , JR | Motorola, Inc | ASSIGNMENT OF ASSIGNORS INTEREST | 005831 | /0851 | |
Aug 28 1991 | WIDMAYER, ROBERT B | Motorola, Inc | ASSIGNMENT OF ASSIGNORS INTEREST | 005831 | /0851 | |
Sep 03 1991 | Motorola, Inc. | (assignment on the face of the patent) | / |
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