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The ornamental design for a stacking enclosure for electronic devices, as shown and described. |
FIG. 1 is a reduced top front and right side perspective view of a stacking enclosure for electronic devices showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 15 1992 | HUI, JOHN T | EVEREX SYSTEMS, INC | ASSIGNMENT OF ASSIGNORS INTEREST | 006049 | /0442 | |
Mar 06 1992 | Everex Systems, Inc. | (assignment on the face of the patent) | / | |||
Oct 05 1992 | EVEREX SYSTEMS, INC 48431 MILMONT DR , FREMONT, CA 94538 | CIT GROUP CREDIT FINANCE, INC , THE | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 006312 | /0030 |
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