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The ornamental design for a capacitive test probe board, as shown and described. |
FIG. 1 is a top, front perspective view of a capacitive test probe board showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a front elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a bottom plan view thereof.
Kerschner, Ronald K., Kent, Lisa M.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 25 1992 | Hewlett-Packard Company | (assignment on the face of the patent) | / | |||
Jan 22 1993 | KERSCHNER, RONALD K | Hewlett-Packard Company | ASSIGNMENT OF ASSIGNORS INTEREST | 006427 | /0279 | |
Jan 22 1993 | KENT, LISA M | Hewlett-Packard Company | ASSIGNMENT OF ASSIGNORS INTEREST | 006427 | /0279 | |
May 20 2000 | HEWLETT-PACKARD COMPANY, A DELAWARE CORPORATION | Agilent Technologies Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010901 | /0336 |
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