Patent
   D345959
Priority
Sep 29 1992
Filed
Sep 29 1992
Issued
Apr 12 1994
Expiry
Apr 12 2008
Assg.orig
Entity
unknown
12
8
n/a
The ornamental design for an electronic circuit housing, as shown and described.

FIG. 1 is a top front perspective view of an electronic circuit housing showing my new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is an end elevational view thereof taken from the left of FIG. 2, the opposite end thereof being the mirror image of the end shown in FIG. 3; and,

FIG. 4 is a rear elevational view thereof.

Cooper, David

Patent Priority Assignee Title
D363268, Aug 30 1993 Unipower Corporation High density DC-DC converter
D365081, Aug 30 1993 UNIPOWER, LLC High density DC-DC converter
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D598848, Jun 23 2008 Meidensha Corporation Electrical double layer capacitor
D986249, Aug 30 2021 SAMSUNG ELECTRONICS CO , LTD Solid state drive memory device
D986899, Aug 30 2021 Samsung Electronics Co., Ltd.; SAMSUNG ELECTRONICS CO , LTD Solid state drive memory device
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Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 24 1992COOPER, DAVIDEldec CorporationASSIGNMENT OF ASSIGNORS INTEREST 0062830502 pdf
Sep 29 1992Eldec Corporation(assignment on the face of the patent)
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