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The ornamental design for a circuit pack faceplate, as shown and described. |
FIG. 1 is a front view of a circuit pack faceplate in accordance with the embodiment of the design;
FIG. 2 is a side view thereof;
FIG. 3 is a view of the side opposite to that shown in FIG. 2;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof;
FIG. 7 is a perspective view thereof;
FIG. 8 is a front view of a circuit pack faceplate in accordance with the second embodiment of the design; and,
FIG. 9 is a side view thereof, all other views are the same as the first embodiment except for the presence of the two ribs at the top of the front.
The broken line showing throughout the drawing figures is included for the purpose of illustrating environmental elements only and forms no part of the claimed design.
Randall, Fredrick G., Alden, Tor A., Cho, Gihyun
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 11 1991 | ALDEN, TOR A | AMERICAN TELEPHONE AND TELEGRAPH COMPANY, A CORP OF NEW YORK | ASSIGNMENT OF ASSIGNORS INTEREST | 005952 | /0551 | |
Dec 11 1991 | CHO, GIHYUN | AMERICAN TELEPHONE AND TELEGRAPH COMPANY, A CORP OF NEW YORK | ASSIGNMENT OF ASSIGNORS INTEREST | 005952 | /0551 | |
Dec 11 1991 | RANDALL, FREDRICK G | AMERICAN TELEPHONE AND TELEGRAPH COMPANY, A CORP OF NEW YORK | ASSIGNMENT OF ASSIGNORS INTEREST | 005952 | /0551 | |
Dec 16 1991 | AT&T Bell Laboratories | (assignment on the face of the patent) | / |
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