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The ornamental design for an electronic circuit housing, as shown and described. |
FIG. 1 is a top front perspective view of an electronic circuit housing showing my new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is an end elevational view thereof taken from the left of FIG. 2, the opposite end thereof being the mirror image of the end shown in FIG. 3;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top front perspective of a second embodiment thereof;
FIG. 6 is a bottom plan view of the second embodiment thereof;
FIG. 7 is an end elevational view of the second embodiment thereof taken from the left of FIG. 6, the opposite end thereof being the mirror image of the end shown in FIG. 7; and,
FIG. 8 is a rear elevational view of the second embodiment thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 09 1993 | Eldec Corporation | (assignment on the face of the patent) | / |
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