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The ornamental design for a microwaveable chip and dip server, as shown and described. |
FIG. 1 is a perspective view of a microwaveable chip and dip server of the present invention;
FIG. 2 is a side elevational view of the microwaveable chip and dip server of FIG. 1, with the opposite side elevational view being identical;
FIG. 3 is a plan view of the microwaveable chip and dip server of FIG. 1;
FIG. 4 is a side elevational view of the microwaveable chip and dip server of FIG. 1 taken ninety degrees away from the view of FIG. 2, with the opposite side elevational view being identical; and,
FIG. 5 is a bottom view of the microwaveable chip and dip server of FIG. 1.
Sarnoff, Norton, Fletcher, Carl R., Chmela, John F., Morris, Laura A.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 22 1993 | SARNOFF, NORTON | Ensar Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006548 | /0892 | |
Feb 22 1993 | FLETCHER, CARL R | Ensar Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006548 | /0892 | |
Feb 22 1993 | MORRIS, LAURA ANN | Ensar Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006548 | /0892 | |
Feb 22 1993 | CHMELA, JOHN FRANK | Ensar Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006548 | /0892 | |
Mar 08 1993 | Ensar Corporation | (assignment on the face of the patent) | / |
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