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The ornamental design for a socket for mounting a printed circuit board module, as shown and described. |
FIG. 1 is a front and upper right perspective of a socket for mounting a printed circuit board module showing my new design. The broken line showing of the module is included for the purpose of illustrating environmental elements only and forms no part of the claimed design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof, the right side elevational view thereof being the same; and,
FIG. 6 is a rearview thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 07 1992 | DEROUICHE, NOUR E | MITSUBISHI SEMICONDUCTOR AMERICA, INC | ASSIGNMENT OF ASSIGNORS INTEREST | 006207 | /0096 | |
Jul 15 1992 | Mitsubishi Semiconductor America, Inc. | (assignment on the face of the patent) | / | |||
Dec 11 1998 | MITSUBISHI SEMICONDUCTOR AMERICA, INC | MITSUBISHI ELECTRONICS AMERICA, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009958 | /0191 |
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