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The ornamental design for a crenellated filament package, as shown and described. |
FIG. 1 is a top plan view of a crenellated filament package, showing my new design;
FIG. 2 is an end view thereof, the undisclosed opposite end being identical;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a second embodiment of the package as in FIG. 1; and,
FIG. 7 is a third embodiment of the package as in FIG. 1.
Patent | Priority | Assignee | Title |
D983030, | Aug 19 2020 | LifeCell Corporation | Packaging |
Patent | Priority | Assignee | Title |
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