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The ornamental design for a sub-unit for data transmission, as shown and described. |
FIG. 1 is a front, top and right side perspective view of a sub-unit for data transmission showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a rear elevational view thereof with the broken line showing included for the purpose of illustrating environmental structure which forms no part of the claimed design;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a front, top and right side perspective view of an another embodiment of the sub-unit for data transmission showing our new design;
FIG. 9 is a top plan view thereof;
FIG. 10 is a bottom plan view thereof;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a rear elevational view thereof with the broken line showing included for the purpose of illustrating environmental structure which forms no part of the claimed design;
FIG. 13 is a left side elevational view thereof; and,
FIG. 14 is a right side elevational view thereof.
Shimizu, Norio, Iwasawa, Shingo
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 19 1993 | SHIMIZU, NORIO | KOYO ELECTRONICS INDUSTRIES CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 006427 | /0793 | |
Jan 19 1993 | IWASAWA, SHINGO | KOYO ELECTRONICS INDUSTRIES CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 006427 | /0793 | |
Feb 02 1993 | Koyo Electronics Industries Co., Ltd. | (assignment on the face of the patent) | / |
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