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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top view showing my new design;
FIG. 2 is a left-side view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a right-side view thereof;
FIG. 5 is a back view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a perspective view.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 20 1992 | Sony Corporation | (assignment on the face of the patent) | / | |||
Aug 24 1992 | TANAKA, SHINTARO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006262 | /0026 |
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