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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top, front and right-side perspective view of a headphone, showing my new design;
FIG. 2 is a top, front and right-side perspective view thereof, shown in the folded position;
FIG. 3 is a reduced front elevational view thereof;
FIG. 4 is a reduced rear elevational view thereof;
FIG. 5 is a reduced left side elevational view thereof;
FIG. 6 is a reduced right side elevational view thereof;
FIG. 7 is a reduced top plan view thereof; and,
FIG. 8 is a reduced bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 13 1993 | WADA, JOH | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006427 | /0540 | |
Feb 05 1993 | Sony Corporation | (assignment on the face of the patent) | / |
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