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The ornamental design for a package for a wafer for the welding and/or cutting of plastic tubes, as shown and described. |
FIG. 1 is a front elevational view of a package for a wafer for the welding and/or cutting of plastic tubes in accordance with this invention shown in the enclosed condition;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof with the right side being a mirror image;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a front elevational view of the package in an opened condition;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a perspective view thereof.
Spencer, Dudley W. C., Ivansons, Ivars V., Ivansons, Valdis
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 12 1994 | IVANSONS, IVARS V | DENCO, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007077 | /0264 | |
Jan 12 1994 | IVANSONS, VALDIS | DENCO, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007077 | /0264 | |
Jan 12 1994 | SPENCER, DUDLEY W C | DENCO, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007077 | /0264 | |
Jan 18 1994 | Denco, Inc. | (assignment on the face of the patent) | / | |||
Oct 15 2010 | DENCO, INC | Genesis BPS, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025517 | /0820 |
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