Patent
   D355848
Priority
Jan 18 1994
Filed
Jan 18 1994
Issued
Feb 28 1995
Expiry
Feb 28 2009
Assg.orig
Entity
unknown
25
8
n/a
The ornamental design for a package for a wafer for the welding and/or cutting of plastic tubes, as shown and described.

FIG. 1 is a front elevational view of a package for a wafer for the welding and/or cutting of plastic tubes in accordance with this invention shown in the enclosed condition;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof with the right side being a mirror image;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a front elevational view of the package in an opened condition;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a perspective view thereof.

Spencer, Dudley W. C., Ivansons, Ivars V., Ivansons, Valdis

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 12 1994IVANSONS, IVARS V DENCO, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0070770264 pdf
Jan 12 1994IVANSONS, VALDISDENCO, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0070770264 pdf
Jan 12 1994SPENCER, DUDLEY W C DENCO, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0070770264 pdf
Jan 18 1994Denco, Inc.(assignment on the face of the patent)
Oct 15 2010DENCO, INC Genesis BPS, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0255170820 pdf
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