|
The ornamental design of the combined headset and infrared transceiver, as shown and described. |
FIG. 1 is a front elevational view of a combined headset and infrared transceiver showing my new design;
FIG. 2 is a left side elevational view of the transceiver shown separately for clarity of illustration;
FIG. 3 is a right side elevational view of FIG. 2;
FIG. 4 is a left side elevational view of the headset shown separately for clarity of illustration;
FIG. 5 is a right side elevational view of FIG. 4;
FIG. 6 is a rear elevational view of FIG. 1;
FIG. 7 is a top plan view of FIG. 2;
FIG. 8 is a top plan view of FIG. 4; and,
FIG. 9 is a bottom plan view of FIG. 1.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 05 1993 | CHENG, CHIN WAH | KOBOL INTERNATIONAL LIMITED | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006883 | /0259 |
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