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The ornamental design for an electronic apparatus housing, as shown and described. |
FIG. 1 is a top perspective view closed of the electronic apparatus housing, showing my new design;
FIG. 2 is a top perspective view open thereof the broken lines being shown for illustrative purposes only and form no part of the claimed design;
FIG. 3 is a top plan view closed thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a front elevation closed thereof;
FIG. 6 is a rear elevation thereof;
FIG. 7 is a left side elevation closed thereof;
FIG. 8 is a left side elevation open thereof; and,
FIG. 9 is a greatly enlarged fragmentary sectional view of the surface of the lower right corner of the upper portion of the housing, as seen in FIG. 2 taken along line 9--9.
The right side of the design is a mirror-image of the left side.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 10 1993 | Vtech Industries, Inc. | (assignment on the face of the patent) | / | |||
Mar 22 1994 | POON, TERENCE TAK WING | VTECH INDUSTRIES, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006934 | /0580 |
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