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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a top, front and right-side perspective view of a headphone, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right-side elevational view thereof, the left-side being a mirror image thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 26 1993 | KANNO, RYUTA | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006810 | 0147 | |
Dec 08 1993 | Sony Corporation | (assignment on the face of the patent) |
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