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The ornamental design for an electronics and instrumentation housing, as shown and described. |
FIG. 1 is a side view of an electronics and instrumentation housing showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a perspective rear/top view thereof;
FIG. 7 is a perspective bottom/rear view thereof;
FIG. 8 is perspective top/front view thereof with lock open;
FIG. 9 is a side view of an alternate embodiment of an electronics and instrumentation housing showing our new design;
FIG. 10 is a front view thereof;
FIG. 11 is rear view thereof;
FIG. 12 is bottom view thereof;
FIG. 13 is a top view thereof;
FIG. 14 is a perspective rear/top view thereof;
FIG. 15 is perspective front/bottom view thereof; and,
FIG. 16 is a perspective top/front view thereof with lock open.
Merilainen, Heikki, Ropponen, Matti
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 15 1994 | Fibox Oy AB | (assignment on the face of the patent) | / | |||
May 31 1994 | ROPPONEN, MATTI | Fibox Oy AB | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007034 | /0773 | |
Jun 01 1994 | MERILAINEN, HEIKKI | Fibox Oy AB | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007034 | /0773 |
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