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The ornamental design for a heat sink device, as shown and described. |
FIG. 1 is an isometric view of a heat sink device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof, the rear elevation view being a mirror image of that shown;
FIG. 4 is a right side elevation view thereof, the left side elevation view being a mirror image of that shown; and,
FIG. 5 is a bottom plan view thereof.
Harmon, Ronald A., Felps, Jimmie D.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 26 1994 | Wakefield Engineering, Inc. | (assignment on the face of the patent) | / | |||
Jul 11 1994 | HARMON, RONALD A | WAKEFIELD ENGINEERING, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007135 | /0513 | |
Jul 27 1994 | WAKEFIELD ENGINEERING, INC | SHAWMUT BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 007109 | /0217 | |
May 20 1998 | Hewlett-Packard Company | Hewlett-Packard Company | MERGER SEE DOCUMENT FOR DETAILS | 010759 | /0049 | |
Nov 01 1999 | Hewlett-Packard Company | Agilent Technologies Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010977 | /0540 | |
Jan 09 2001 | WAKEFIELD ENGINEERING, INC | UNION BANK OF CALIFORNIA, N A | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011506 | /0648 | |
Aug 09 2001 | WAKEFIELD ENGINEERING, INC | WAKEFIELD THERMAL SOLUTIONS, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 017519 | /0029 | |
Apr 24 2006 | ENDURANCE CAPITAL LP, SUCCESSOR-IN-INTEREST TO UNION BANK OF CALIFORNIA, N A | WAKEFIELD ENGINEERING, INC | NOTICE OF TERMINATION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY | 017519 | /0898 | |
Apr 27 2006 | AT BROAD STREET PARTNERS, LLC, SUCCESSOR-IN-INTEREST TO UNION BANK OF CALIFORNIA, N A | WAKEFIELD ENGINEERING, INC | NOTICE OF TERMINATION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY | 017537 | /0721 | |
May 02 2006 | WAKEFIELD THERMAL SOLUTIONS, INC | WACHOVIA CAPITAL FINANCE CORPORATION NEW ENGLAND | SECURITY AGREEMENT | 017636 | /0574 |
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