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The ornamental design for a heat sink device, as shown and described. |
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FIG. 1 is an isometric view of a heat sink device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof, the rear elevation view being a mirror image of that shown;
FIG. 4 is a right side elevation view thereof, the left side elevation view being a mirror image of that shown; and,
FIG. 5 is a bottom plan view thereof.
Harmon, Ronald A., Felps, Jimmie D.
| Patent | Priority | Assignee | Title |
| 6053240, | Aug 09 1996 | LASALLE BUSINESS CREDIT, INC , AS AGENT | Heat sink |
| 6401807, | Apr 03 1997 | SILENT SYSTEMS, INC | Folded fin heat sink and fan attachment |
| 7686469, | Sep 30 2006 | IDEAL Industries Lighting LLC | LED lighting fixture |
| 7952262, | Sep 30 2006 | IDEAL Industries Lighting LLC | Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules |
| 8070306, | Sep 30 2006 | IDEAL Industries Lighting LLC | LED lighting fixture |
| 8425071, | Sep 30 2006 | IDEAL Industries Lighting LLC | LED lighting fixture |
| 9028087, | Sep 30 2006 | IDEAL Industries Lighting LLC | LED light fixture |
| 9039223, | Sep 30 2006 | IDEAL Industries Lighting LLC | LED lighting fixture |
| 9243794, | Sep 30 2006 | IDEAL Industries Lighting LLC | LED light fixture with fluid flow to and from the heat sink |
| 9261270, | Sep 30 2006 | IDEAL Industries Lighting LLC | LED lighting fixture |
| 9534775, | Sep 30 2006 | IDEAL Industries Lighting LLC | LED light fixture |
| 9541246, | Sep 30 2006 | IDEAL Industries Lighting LLC | Aerodynamic LED light fixture |
| D422970, | Apr 08 1997 | I.E.R.C. (International Electronic Research Corp. | Heat sink |
| D758327, | Sep 30 2014 | Valeo Vision | Heat sink for a lighting device module for a vehicle |
| D933617, | Sep 13 2019 | CAVIUM INTERNATIONAL; Marvell Asia Pte Ltd | Heat sink cover |
| Patent | Priority | Assignee | Title |
| 3212569, | |||
| 4209839, | Jun 16 1978 | International Business Machines Corporation | Shared synchronous memory multiprocessing arrangement |
| 4544942, | Feb 22 1982 | LASALLE BUSINESS CREDIT, INC | Heat sinks with staked solderable studs |
| 4552206, | Jan 17 1983 | LASALLE BUSINESS CREDIT, INC | Heat sinks for integrated circuit modules |
| 5010949, | Mar 22 1988 | Bull, S.A. | Device for fastening together under pressure two pieces, one to the other |
| 5099310, | Jul 26 1982 | Sumitomo Electric Industries, Ltd. | Substrate for semiconductor apparatus |
| 5130888, | May 31 1984 | Aavid Thermalloy, LLC | Spring clip fastener for surface mounting of printed circuit board components |
| 5200809, | Sep 27 1991 | SEONG CAPITAL LTD LIMITED LIABILITY COMPANY | Exposed die-attach heatsink package |
| 5270902, | Dec 16 1992 | International Business Machines Corporation | Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip |
| 5276584, | Oct 31 1991 | INDEPENDENCE MANZANAR LLC | Electronic unit |
| 5289337, | Feb 21 1992 | Intel Corporation | Heatspreader for cavity down multi-chip module with flip chip |
| 5307236, | Jul 23 1991 | Alcatel Telspace | Heatsink for contact with multiple electronic components mounted on a circuit board |
| 5311395, | Oct 29 1992 | TAIWAN SEMICONDUCTOR MANUFACTURING CO , LTD | Surface mount heat sink |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| May 26 1994 | Wakefield Engineering, Inc. | (assignment on the face of the patent) | / | |||
| Jul 11 1994 | HARMON, RONALD A | WAKEFIELD ENGINEERING, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007135 | /0513 | |
| Jul 27 1994 | WAKEFIELD ENGINEERING, INC | SHAWMUT BANK, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 007109 | /0217 | |
| May 20 1998 | Hewlett-Packard Company | Hewlett-Packard Company | MERGER SEE DOCUMENT FOR DETAILS | 010759 | /0049 | |
| Nov 01 1999 | Hewlett-Packard Company | Agilent Technologies Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010977 | /0540 | |
| Jan 09 2001 | WAKEFIELD ENGINEERING, INC | UNION BANK OF CALIFORNIA, N A | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011506 | /0648 | |
| Aug 09 2001 | WAKEFIELD ENGINEERING, INC | WAKEFIELD THERMAL SOLUTIONS, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 017519 | /0029 | |
| Apr 24 2006 | ENDURANCE CAPITAL LP, SUCCESSOR-IN-INTEREST TO UNION BANK OF CALIFORNIA, N A | WAKEFIELD ENGINEERING, INC | NOTICE OF TERMINATION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY | 017519 | /0898 | |
| Apr 27 2006 | AT BROAD STREET PARTNERS, LLC, SUCCESSOR-IN-INTEREST TO UNION BANK OF CALIFORNIA, N A | WAKEFIELD ENGINEERING, INC | NOTICE OF TERMINATION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY | 017537 | /0721 | |
| May 02 2006 | WAKEFIELD THERMAL SOLUTIONS, INC | WACHOVIA CAPITAL FINANCE CORPORATION NEW ENGLAND | SECURITY AGREEMENT | 017636 | /0574 |
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