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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a perspective view of a headphone showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a perspective view of an alternate embodiment of FIG. 1;
FIG. 9 is a top plan view of FIG. 8;
FIG. 10 is a left side elevational view of FIG. 8; and,
FIG. 11 is a right side elevational view of FIG. 8.
The undisclosed rear and bottom views of the alternate embodiment are the same as FIGS. 3 and 5 respectively.
Patent | Priority | Assignee | Title |
4993074, | Apr 13 1988 | Earphone spacer | |
5138722, | Jul 02 1991 | DAVID CLARK COMPANY INC | Headset ear seal |
204886, | |||
222361, | |||
D255352, | Feb 06 1978 | Koss Corporation | Headphone |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 04 1994 | Sony Corporation | (assignment on the face of the patent) | ||||
Dec 06 1994 | MORIMIYA, YUJI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007274 | 0840 |
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