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The ornamental design for a base board for a package, as shown and described. |
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FIG. 1 is a perspective view of a base board for a package from the front, right side and bottom;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof, the left side being identical thereto; and,
FIG. 5 is a top plan view thereof, the bottom being identical thereto.
The stippling which appears in FIGS. 1 and 2 depicts a graphical pattern on the front surface of the article.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jul 06 1994 | MORITA, TAKASHI | AIWA CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007085 | /0058 | |
| Jul 25 1994 | Aiwa Co., Ltd. | (assignment on the face of the patent) | / |
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