Patent
   D374866
Priority
Apr 27 1995
Filed
Apr 27 1995
Issued
Oct 22 1996
Expiry
Oct 22 2010
Assg.orig
Entity
unknown
10
5
n/a
The ornamental design for a scalable processing architecture (SPARC) computer motherboard, as shown and described.

FIG. 1 is a perspective view of a first embodiment of the scalable processing architecture (SPARC) computer motherboard embodying my new design;

FIG. 2 is a top elevational view thereof;

FIG. 3 is a back side view thereof;

FIG. 4 is a front side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a bottom view thereof.

Johnston, Mark L.

Patent Priority Assignee Title
D397093, Jul 30 1997 BEST LIGHTING PRODUCTS, INC Printed circuit board with mounted components
D430856, Aug 05 1999 Alan W., Wilkerson Circuit board
D794034, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D794641, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D794642, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
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D795261, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D795262, Jan 07 2009 Samsung Electronics Co., Ltd. Memory device
D909319, Jul 08 2020 Impact IP, LLC Circuit board
Patent Priority Assignee Title
4031371, Mar 08 1976 Monolithic Systems Corporation Microcomputer board having wire-wrap terminals
5287009, Jan 30 1989 Circuit module fan assembly
5397919, Mar 04 1993 Tyco Electronics Logistics AG Heat sink assembly for solid state devices
D275279, Aug 15 1980 Redcom Laboratories, Inc. High density component mounting back panel for electronic equipment
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 27 1995Cycle Computer Corp.(assignment on the face of the patent)
Jun 14 1995JOHNSTON, MARK L Cycle Computer CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0075240459 pdf
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