|
The ornamental design for a scalable processing architecture (SPARC) computer motherboard, as shown and described. |
FIG. 1 is a perspective view of a first embodiment of the scalable processing architecture (SPARC) computer motherboard embodying my new design;
FIG. 2 is a top elevational view thereof;
FIG. 3 is a back side view thereof;
FIG. 4 is a front side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a bottom view thereof.
Patent | Priority | Assignee | Title |
D397093, | Jul 30 1997 | BEST LIGHTING PRODUCTS, INC | Printed circuit board with mounted components |
D430856, | Aug 05 1999 | Alan W., Wilkerson | Circuit board |
D794034, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D794641, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D794642, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D794643, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D794644, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D795261, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D795262, | Jan 07 2009 | Samsung Electronics Co., Ltd. | Memory device |
D909319, | Jul 08 2020 | Impact IP, LLC | Circuit board |
Patent | Priority | Assignee | Title |
4031371, | Mar 08 1976 | Monolithic Systems Corporation | Microcomputer board having wire-wrap terminals |
5287009, | Jan 30 1989 | Circuit module fan assembly | |
5397919, | Mar 04 1993 | Tyco Electronics Logistics AG | Heat sink assembly for solid state devices |
D275279, | Aug 15 1980 | Redcom Laboratories, Inc. | High density component mounting back panel for electronic equipment |
D304441, | Jul 08 1986 | Interplex Electronics, Inc. | Breadboarding card for a personal computer |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 27 1995 | Cycle Computer Corp. | (assignment on the face of the patent) | / | |||
Jun 14 1995 | JOHNSTON, MARK L | Cycle Computer Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007524 | /0459 |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |