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The ornamental design for a facsimile, as shown and described. |
FIG. 1 is a perspective view of a facsimile showing my new design;
FIG. 2 is a perspective view thereof; with the cover shown in open position;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a left-side elevational view thereof; and,
FIG. 8 is a right-side elevational view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 06 1996 | LIM, BONG WOOK | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007925 | /0001 | |
Jan 16 1996 | Samsung Electronics Co., Ltd. | (assignment on the face of the patent) | / |
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