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The ornamental design for an integrated circuit chip holding device, as shown and described. |
FIG. 1 is a front view of my new design of integrated circuit chip holding device;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a perspective view thereof taken from the top, front, left side of the device.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 14 1994 | Shinano Electronics Co., Ltd. | (assignment on the face of the patent) | / | |||
Aug 29 1994 | ITOH, MASATO | SHINANO ELECTRONICS CO , LTD | CORRECTIVE ASSIGNMENT-SEE RECORD FOR DETAILS | 007539 | /0032 |
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