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The ornamental design for an overmold and housing for an interface cable, as shown and described. |
FIG. 1 is a perspective view showing a top, right, and front side of a preferred embodiment of our new design for an overmold and housing for an interface cable in accordance with the present invention;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a rear elevational view thereof; and,
FIG. 4 is a bottom plan view thereof.
Portions of the drawings shown in phantom are provided for reference only and form no part of the design.
Rak, Roman P., Fenton, William E.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 30 1995 | Motorola, Inc. | (assignment on the face of the patent) | / | |||
Sep 22 1995 | RAK, ROMAN P | Motorola, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007748 | /0902 | |
Sep 22 1995 | FENTON, WILLIAM E | Motorola, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007748 | /0902 |
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