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The ornamental design for a modular, stacking, electronic enclosure system, as shown and described. |
FIG. 1 is a front view of a modular stacking electronic enclosure system showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a top perspective view thereof;
FIG. 8 is a bottom perspective view thereof;
FIG. 9 is a left side elevational view of a second embodiment thereof;
FIG. 10 is a right side elevational view thereof;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a rear elevational view thereof;
FIG. 13 is a top plan view thereof;
FIG. 14 is a top perspective view thereof; and,
FIG. 15 is a bottom perspective view thereof.
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Patent | Priority | Assignee | Title |
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 23 1995 | NOGAS, DAVID A | Mitel Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007620 | /0647 | |
Aug 30 1995 | Mitel Corporation | (assignment on the face of the patent) | / | |||
Feb 12 1998 | MITEL CORPORATION, A CORP OF CANADA | CANADIAN IMPERIAL BANK OF COMMERCE, AS SECURED PARTY | GRANT OF PATENT SECURITY INTEREST | 009114 | /0489 | |
Feb 15 2001 | Mitel Corporation | Mitel Knowledge Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011871 | /0001 |
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