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The ornamental design for the power module cover, as shown and described. |
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FIG. 1 is a bottom plan view of the power module cover;
FIG. 2 is a top plan view of the power module cover;
FIG. 3 is a rear elevational view of the power module cover;
FIG. 4 is a side elevational view of the power module cover taken from the left side thereof;
FIG. 5 is a side elevational view of the power module cover taken from the right side thereof;
FIG. 6 is a front elevational view of the power module cover; and,
FIG. 7 is a perspective view of the power module cover.
Gerber, Mark A., Strittmatter, Michael K.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 06 1996 | Dallas Semiconductor Corp. | (assignment on the face of the patent) | / | |||
| Sep 30 1996 | GERBER, MARK A | Dallas Semiconductor Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008193 | /0548 | |
| Sep 30 1996 | STRITTMATTER, MICHAEL K | Dallas Semiconductor Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008193 | /0548 |
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