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The ornamental design for the power cap cover, as shown and described. |
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FIG. 1 is a top plan view of the power cap cover;
FIG. 2 is a bottom plan view of the power cap cover;
FIG. 3 is a front elevational view of the power cap cover;
FIG. 4 is a side elevational view of the power cap cover taken from the right side thereof;
FIG. 5 is a rear elevational view of the power cap cover;
FIG. 6 is a side elevational view of the power cap cover taken from the left side thereof; and,
FIG. 7 is a perspective view of the power cap cover.
McLellan, Neil, Gerber, Mark A., Strittmatter, Michael K.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 06 1996 | Dallas Semiconductor Corporation | (assignment on the face of the patent) | / | |||
| Dec 09 1996 | GERBER, MARK A | Dallas Semiconductor Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008540 | /0495 | |
| Dec 09 1996 | STRITTMATTER, MICHAEL K | Dallas Semiconductor Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008540 | /0495 | |
| Feb 25 1997 | MCLELLAN, NEIL | Dallas Semiconductor Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008540 | /0495 |
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