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The ornamental design for a stampless envelope, as shown and described. |
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FIG. 1 is a front elevational view of a stampless envelope showing my new design, the indicia depicted by means of broken lines in the upper left-hand corner being for illustrative purposes only and forming no part of the claimed design; and,
FIG. 2 is a rear elevational view thereof.
It is understood that the sides of the envelope are of no substantial thickness.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Aug 05 1996 | E-Stamp Corporation | (assignment on the face of the patent) | / | |||
| Sep 01 1996 | POST N MAIL, L C | E-Stamp Corporation | MERGER SEE DOCUMENT FOR DETAILS | 008222 | /0263 | |
| Jul 26 1999 | E-Stamp Corporation | TRANSAMERICA BUSINESS CREDIT CORP | SECURITY AGREEMENT | 010340 | /0030 | |
| Apr 24 2001 | Transamerica Business Credit Corporation | E-Stamp Corporation | RELEASE OF PATENT LIENS | 011821 | /0858 | |
| Apr 27 2001 | E-Stamp Corporation | STAMPS COM INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011911 | /0216 |
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