|
The ornamental design for an electronic device, as shown and described. |
FIG. 1 is a front view of an electronic device showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a left side view thereof with a right side view appearing as mirror image to the left side view;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a perspective view from a view point at the right and above the electronic device in FIG. 1; and,
FIG. 7 is a perspective view from a point at the right and above the electronic device in FIG. 2.
Kitamura, Hideki, Yanaka, Hiroshi
Patent | Priority | Assignee | Title |
ER1826, |
Patent | Priority | Assignee | Title |
5302778, | Aug 28 1992 | Eastman Kodak Company; EASTMAN KODAK COMPANY A NJ CORP | Semiconductor insulation for optical devices |
5357673, | Aug 26 1991 | TEMIC AUTOMOTIVE OF NORTH AMERICA, INC | Semiconductor device encapsulation method |
D244095, | Jul 28 1975 | Capacitor | |
D356778, | Mar 25 1993 | Seiko Epson Corporation | Piezoelectric semiconductor element |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 04 1996 | YANAKA, HIROSHI | Elna Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008414 | /0629 | |
Dec 04 1996 | KITAMURA, HIDEKI | Elna Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008414 | /0629 | |
Dec 10 1996 | Elna Kabushiki Kaisha | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |