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The ornamental design for a modular housing for electrical circuits, as shown and described. |
FIG. 1 is a front top perspective view of a first embodiment of the modular housing for electrical circuits;
FIG. 2 is a rear perspective view of the unit of FIG. 1;
FIG. 3 is a front view of the unit of FIG. 1;
FIG. 4 is a top view of the unit of FIG. 1;
FIG. 5 is a left side view of the unit of FIG. 1;
FIG. 6 is a right side view of the unit of FIG. 1;
FIG. 7 is a bottom view of the unit of FIG. 1;
FIG. 8 is a rear view of the unit of FIG. 1;
FIG. 9 is a front top perspective view of a second embodiment of the modular housing for electrical circuits;
FIG. 10 is a rear perspective view of the unit of FIG. 9;
FIG. 11 is a front view of the unit of FIG. 9;
FIG. 12 is a top view of the unit of FIG. 9;
FIG. 13 is a left side view of the unit of FIG. 9;
FIG. 14 is a right side view of the unit of FIG. 9;
FIG. 15 is a bottom view of the unit of FIG. 9;
FIG. 16 is a rear view of the unit of FIG. 9;
FIG. 17 is a front top perspective view of a third embodiment of the modular housing for electrical circuits in which a front user replaceable and insertable strip has been removed; and,
FIG. 18 is a front view of the unit as shown in FIG. 17.
The undisclosed right side, bottom and rear views of the third embodiment of the modular housing for electrical circuits are identical to those of the second embodiment.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 13 1995 | BENDER, WERNER | PILZ GMBH & CO | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007680 | /0649 | |
Sep 19 1995 | Pilz GmbH & Co. | (assignment on the face of the patent) | / |
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